Panel RDL Interposer or Substrate (PRIS) for a Vertical-Cavity Surface-Emitting Laser (VCSEL)
In this study, the transformation of high-speed electrical signals into optical signals using a glass panel RDL interposer or substrate (PRIS) integrated with a vertical-cavity surface-emitting laser (VCSEL) chip is investigated for co-packaged optics (CPO) applications. Emphasis is placed on the design, fabrication, and electrical and optical characterization of the package. S-parameters simulations are performed and compared with experimental results. In addition, a 56 Gbps PAM-4 optical eye diagram is measured and characterized.
Authors
- John H. Lau (ORCID: https://orcid.org/0000-0003-1284-8829)
- Chao‐Hsin Wu (ORCID: https://orcid.org/0000-0001-7849-773X)
- Kai Pan (ORCID: https://orcid.org/0000-0003-1841-1556)
- Tzong‐Lin Wu (ORCID: https://orcid.org/0000-0002-3560-8898)
- Yun-Cheng Yang (ORCID: https://orcid.org/0000-0003-0022-1295)
- Chia-Yu Peng
- Kaiming Yang (ORCID: https://orcid.org/0009-0000-7734-0095)
- Jinsheng Wang (ORCID: https://orcid.org/0009-0007-1841-1552)
- Puru Bruce Lin
- Mike Ma
- Cheng-Ta Ko
Institutions
- National Taiwan University (TW)
- Micron Corporation (United States) (US)
Publication Details
- Journal
- IMAPSource Proceedings
- Published
- 2025-11-10
- DOI
- https://doi.org/10.4071/001c.147228
- Primary Topic
- Semiconductor Lasers and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Taiwan University