High-Performance PCB Materials for Next-Generation Electronics Packages, driving Signal Integrity, Power Handling, and Reliability

This paper provides an overview in the advancement of high-frequency, high-speed and high thermal-conductivity PCB materials critical for next-generation electronics packages, with a focus on enhancing signal integrity, power handling, and reliability. Specifically, we address the interface challenges between PCB materials and electronic packages. Further, the paper provides insights into specific aerospace and defense needs and demonstrates the practical benefits of materials in relation to environmental requirements and fabrication processes. The study aims to provide a PCB material “toolbox” to the assembly and packaging community, highlighting the importance of these materials in meeting the demands of evolving high performance electronic applications.