Cavity-backed Antennas using Quartz Glass on Silicon Hybrid Bonded Wafers for Sub-THz Communication and Radar Applications

In this work, we present a novel cavity-backed wideband and high gain antenna using Quartz glass and silicon bonded wafers for sub-THz wireless communication and radar sensing applications. We rigorously studied the impact of the dimensions of the cavity on the gain, bandwidth and radiation pattern of the antenna. Test samples of the antenna were fabricated and measured. Excellent correlation was obtained between measurement and simulation results. For optimal cavity dimensions, maximum gain per patch element of approximately 7 dBi and bandwidth of 14 GHz were obtained.

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Publication Details

Journal
IMAPSource Proceedings
Published
2025-11-10
DOI
https://doi.org/10.4071/001c.147201
Primary Topic
3D IC and TSV technologies
Type
article
Field-Weighted Citation Impact
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article

Cavity-backed Antennas using Quartz Glass on Silicon Hybrid Bonded Wafers for Sub-THz Communication and Radar Applications

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IMAPSource Proceedings
3D IC and TSV technologies
article

Cavity-backed Antennas using Quartz Glass on Silicon Hybrid Bonded Wafers for Sub-THz Communication and Radar Applications

Makoto Iwai, Uwe Maaß, Jungo Kondo, Masato Tokai, Ivan Ndip, Alexander Gäbler, Nobuo Okada, Shoichiro Yamaguchi, Kentaro Tani, Wojciech Partyka
article en

Abstract

In this work, we present a novel cavity-backed wideband and high gain antenna using Quartz glass and silicon bonded wafers for sub-THz wireless communication and radar sensing applications. We rigorously studied the impact of the dimensions of the cavity on the gain, bandwidth and radiation pattern of the antenna. Test samples of the antenna were fabricated and measured. Excellent correlation was obtained between measurement and simulation results. For optimal cavity dimensions, maximum gain per patch element of approximately 7 dBi and bandwidth of 14 GHz were obtained.

IMAPSource ProceedingsVol. 2025(Symposium)
NGK Insulators (Japan) (JP), Fraunhofer Institute for Reliability and Microintegration (DE), Brandenburg University of Technology Cottbus-Senftenberg (DE)
Openalex Percentile: Top 66%
3D IC and TSV technologies
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