A compact, low-power total reflection X-ray fluorescence (TXRF) spectrometer designed for surface metal contamination analysis of silicon wafers

Total reflection X-ray fluorescence (TXRF) is a key analytical technique for detecting surface metal contamination on silicon wafers. While mature commercial instruments provide excellent detection performance, they are typically large, heavy, and equipped with high-power X-ray tubes, the use of high-power X-ray tubes (The X-ray tube typically operates at a power of approximately 1500 W.) leads to increased power consumption. In this study, a compact, low-power TXRF-based spectrometer was developed specifically for wafer metal contamination detection. A new quantitative analysis method was employed to mitigate the effects associated with the use of a low-power X-ray tube. The instrument's performance was evaluated using silicon wafers deliberately contaminated with Fe, Ni, and Cu. Elemental mapping and quantitative analysis were conducted using custom Python-based software. The results demonstrate that the spectrometer offers reliable sensitivity and accuracy for detecting surface contaminants on silicon wafers. • A compact low power TXRF spectrometer was developed for wafer contamination analysis. • Quantification was corrected using X-ray attenuation and intensity–concentration curves. • A mapping tool visualizes contaminant location, type, and concentration on wafers.