Error Term Analysis in 16-Term Calibration: Enhancing SiGe HBT S-Parameter Accuracy up to 330 GHz

This paper discusses the challenges involved in characterizing high-frequency SiGe HBT transistors. Process engineers continually strive to enhance device performance by shrinking dimensions and minimising parasitic capacitances; however, these capacitances—on the order of only a few femtofarads—are particularly susceptible to measurement errors. Moreover, commercial RF probes often guide electromagnetic fields inefficiently, inducing substrate coupling and crosstalk that further degrade measurement accuracy. To investigate these issues, we apply on-wafer 16-term calibration techniques using accurately designed calibration standards. Starting from the full 16-term error-correction model and progressively simplifying it in a step-by-step manner, we compare the performance of 16-, 10-, and 8-term calibrations and, finally, traditional TRL calibration up to <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$330 \text{G H z}$</tex>. We verify the consistency of these approaches, analyse their influence on the extraction of passive elements, and evaluate how each calibration scheme affects key transistor performance metrics, such as the maximum oscillation frequency <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(f_{\text{max }})$</tex>.

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Published
2025-09-22
DOI
https://doi.org/10.23919/eumic65284.2025.11234505
Primary Topic
Radio Frequency Integrated Circuit Design
Type
article
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article

Error Term Analysis in 16-Term Calibration: Enhancing SiGe HBT S-Parameter Accuracy up to 330 GHz

Jobin Varghese, Sébastien Frégonèse, Thomas Zimmer, Tarek Bouzar et al.
Radio Frequency Integrated Circuit Design
article

Error Term Analysis in 16-Term Calibration: Enhancing SiGe HBT S-Parameter Accuracy up to 330 GHz

Jobin Varghese, Sébastien Frégonèse, Thomas Zimmer, Tarek Bouzar, Jean Daniel Arnould
article en

Abstract

This paper discusses the challenges involved in characterizing high-frequency SiGe HBT transistors. Process engineers continually strive to enhance device performance by shrinking dimensions and minimising parasitic capacitances; however, these capacitances—on the order of only a few femtofarads—are particularly susceptible to measurement errors. Moreover, commercial RF probes often guide electromagnetic fields inefficiently, inducing substrate coupling and crosstalk that further degrade measurement accuracy. To investigate these issues, we apply on-wafer 16-term calibration techniques using accurately designed calibration standards. Starting from the full 16-term error-correction model and progressively simplifying it in a step-by-step manner, we compare the performance of 16-, 10-, and 8-term calibrations and, finally, traditional TRL calibration up to <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$330 \text{G H z}$</tex>. We verify the consistency of these approaches, analyse their influence on the extraction of passive elements, and evaluate how each calibration scheme affects key transistor performance metrics, such as the maximum oscillation frequency <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(f_{\text{max }})$</tex>.

Université de Bordeaux (FR), Techniques of Informatics and Microelectronics for Integrated Systems Architecture (FR), Institut Polytechnique de Bordeaux (FR), Université Grenoble Alpes (FR)
Openalex Percentile: Top 66%
Radio Frequency Integrated Circuit Design
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