A Multiport Transistor Characterisation Technique Including Mutual Inductances Using 2-Port VNA

This paper introduces a novel measurement technique for 4-pin SiC MOSFET transistors with TO-247-4 packaging, accounting for mutual inductances and utilizing a two-port vector network analyzer (VNA). The proposed method involves six distinct measurements to obtain a <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{4 x} \text{4}$</tex> S-parameter matrix, which is subsequently reduced by implementing a “virtual ground” in Advanced Design System (ADS) to achieve optimal grounding for one of the transistor's pins. This approach ensures ideal grounding conditions for accurate measurements and allows ease of power and driver gate inductance loops extraction. Additionally, the paper details the RLC extraction process of the evaluated SiC transistor and compares the extracted capacitance values with those specified in the datasheet.

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Published
2025-10-08
DOI
https://doi.org/10.1109/ee67693.2025.11227091
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
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article

A Multiport Transistor Characterisation Technique Including Mutual Inductances Using 2-Port VNA

Bruno Allard, Paul-Etienne Vidal, Kenneth E. Kolodziej, Stéphane Baffreau
Silicon Carbide Semiconductor Technologies
article

A Multiport Transistor Characterisation Technique Including Mutual Inductances Using 2-Port VNA

Bruno Allard, Paul-Etienne Vidal, Kenneth E. Kolodziej, Stéphane Baffreau
article en

Abstract

This paper introduces a novel measurement technique for 4-pin SiC MOSFET transistors with TO-247-4 packaging, accounting for mutual inductances and utilizing a two-port vector network analyzer (VNA). The proposed method involves six distinct measurements to obtain a <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{4 x} \text{4}$</tex> S-parameter matrix, which is subsequently reduced by implementing a “virtual ground” in Advanced Design System (ADS) to achieve optimal grounding for one of the transistor's pins. This approach ensures ideal grounding conditions for accurate measurements and allows ease of power and driver gate inductance loops extraction. Additionally, the paper details the RLC extraction process of the evaluated SiC transistor and compares the extracted capacitance values with those specified in the datasheet.

Université Claude Bernard Lyon 1 (FR), Laboratoire Génie de Production (FR), Institut National des Sciences Appliquées de Lyon (FR)
Openalex Percentile: Top 66%
Silicon Carbide Semiconductor Technologies
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