Reducing Coercive Field and Improving Endurance in Ferroelectric Epitaxial Hf <sub>0.5</sub> Zr <sub>0.5</sub> O <sub>2</sub> Thin Films via Novel Interface Layer Approach

Ferroelectric doped hafnium oxide (HfO<sub>2</sub>) has emerged as CMOS-compatible and scalable ferroelectric for next-generation memory/in-memory computing devices. However, its high coercive field (E<sub>c</sub>) and limited endurance remain key obstacles. Here, a ≈25% reduction in E<sub>c</sub> from 3.3 to 2.5 MV/cm and an order of magnitude increase in endurance by implementing an ultrathin (≈2 nm) 5 at.% Sm-doped HZO (HZSO) ionic conducting underlayer for HZO are shown. X-ray photoelectron spectroscopy (XPS) results reveal the absence of redox effects during primary ferroelectric switching in HZSO, unlike in HZO. NEB calculations show that V<sub>O</sub>-rich HZSO lowers the switching barrier compared to that of HZO, which agrees with experimental results. Notably, these improvements are achieved in HZSO|HZO without compromising P<sub>r</sub> compared to HZO. This approach presents a new powerful route to engineering ferroelectric properties in doped HfO<sub>2</sub>, applicable to both epitaxial and polycrystalline films for future memory devices.

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Publication Details

Journal
Advanced Science
Published
2025-11-14
DOI
https://doi.org/10.1002/advs.202517314
Primary Topic
Ferroelectric and Negative Capacitance Devices
Type
article
Field-Weighted Citation Impact
0.00

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article

Reducing Coercive Field and Improving Endurance in Ferroelectric Epitaxial Hf 0.5 Zr 0.5 O 2 Thin Films via Novel Interface Layer Approach

Benedetta Gaggio, Judith L. MacManus‐Driscoll, Duk‐Hyun Choe, Veniero Lenzi et al.
Advanced Science
Ferroelectric and Negative Capacitance Devices
article

Reducing Coercive Field and Improving Endurance in Ferroelectric Epitaxial Hf 0.5 Zr 0.5 O 2 Thin Films via Novel Interface Layer Approach

Benedetta Gaggio, Judith L. MacManus‐Driscoll, Duk‐Hyun Choe, Veniero Lenzi, Simon M. Fairclough, Babak Bakhit, Nives Strkalj, José Silva, Ji Soo Kim
article en

Abstract

Ferroelectric doped hafnium oxide (HfO<sub>2</sub>) has emerged as CMOS-compatible and scalable ferroelectric for next-generation memory/in-memory computing devices. However, its high coercive field (E<sub>c</sub>) and limited endurance remain key obstacles. Here, a ≈25% reduction in E<sub>c</sub> from 3.3 to 2.5 MV/cm and an order of magnitude increase in endurance by implementing an ultrathin (≈2 nm) 5 at.% Sm-doped HZO (HZSO) ionic conducting underlayer for HZO are shown. X-ray photoelectron spectroscopy (XPS) results reveal the absence of redox effects during primary ferroelectric switching in HZSO, unlike in HZO. NEB calculations show that V<sub>O</sub>-rich HZSO lowers the switching barrier compared to that of HZO, which agrees with experimental results. Notably, these improvements are achieved in HZSO|HZO without compromising P<sub>r</sub> compared to HZO. This approach presents a new powerful route to engineering ferroelectric properties in doped HfO<sub>2</sub>, applicable to both epitaxial and polycrystalline films for future memory devices.

Advanced ScienceVol. 13(5)
Samsung (South Korea) (KR), University of Cambridge (GB), Institute for Advanced Laser Dentistry (US), Institute of Physics (HR), University of Minho (PT)
Samsung Advanced Institute of Technology, Henry Royce Institute, Royal Academy of Engineering, European Commission, Lunds Universitet, Samsung, Horizon 2020 Framework Programme, HORIZON EUROPE Framework Programme, Engineering and Physical Sciences Research Council, Trinity College, University of Cambridge, Fundação para a Ciência e a Tecnologia, Department of Materials Science and Metallurgy, University of Cambridge, HORIZON EUROPE Marie Sklodowska-Curie Actions
Openalex Percentile: Top 66%
Ferroelectric and Negative Capacitance Devices
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