HEAT TRANSFER PERFORMANCE ANALYSIS OF MICRO CHANNEL HEAT SINKS WITH POROUS SUBSTRATE INTEGRATION

This research focuses on improving the thermal efficiency of microchannel heat sinks (MCHSs) by integrating porous materials into the channel architecture. Numerical simulations were carried out in COMSOL Multiphysics, utilizing the Brinkman–Forchheimer extended Darcy model to comprehensively represent momentum and heat transfer within the porous structure. Various simulations assessed how different porous layer thicknesses influence critical performance metrics such as the heat transfer coefficient, pressure loss, Nusselt number, and Reynolds number. The incorporation of porous media was found to markedly boost thermal performance by expanding the fluid–solid interface area and promoting enhanced convective heat transfer. When compared with traditional MCHS designs, the porous-enhanced configurations showed a 15–30% improvement in both heat transfer coefficient and Nusselt number, though accompanied by an approximately 20% increase in pressure drop. The optimal performance was achieved with a porous layer thickness of 0.1 mm, as evidenced by the peak Figure of Merit (FOM), reflecting the most favorable trade-off between thermal enhancement and hydraulic resistance. These outcomes highlight the potential of porous-augmented microchannels as a compact and efficient thermal management strategy for electronics subjected to high heat fluxes. The study adds to the current body of knowledge by offering detailed insights into design factors affecting the effectiveness of porous microchannel systems.