Seamless in two dimensions: prospects of lateral heterostructures from integration to quantum devices
Lateral heterostructures of two-dimensional (2D) transition metal dichalcogenides feature atomically sharp, covalently stitched 1D interfaces that enable direct band-to-band coupling. This perspective highlights their unique ability to control quasiparticles, excitons, and spins, with implications for optoelectronics, excitonic and valleytronic devices, tunneling field-effect transistors, neuromorphic computing, spintronics, and quantum circuits. It also outlines challenges in scalable synthesis, interface engineering, and 2D–3D integration, charting paths toward future quantum technologies.
Authors
- Suman Kumar Chakraborty (ORCID: https://orcid.org/0000-0002-5454-9766)
- Bernhard Urbaszek (ORCID: https://orcid.org/0000-0003-0226-7983)
- Praveen Kumar (ORCID: https://orcid.org/0000-0002-7333-1519)
- Rohit Medwal (ORCID: https://orcid.org/0000-0003-0648-2592)
- Prasana K. Sahoo (ORCID: https://orcid.org/0000-0001-6316-7842)
- Puneet A. Murthy (ORCID: https://orcid.org/0000-0003-2945-3508)
- B.B. Nayak (ORCID: https://orcid.org/0000-0001-8944-1811)
- Avinash Patsha (ORCID: https://orcid.org/0000-0002-6006-0748)
- Baisali Kundu
- Purbasha Ray
- Sachin Kumar (ORCID: https://orcid.org/0000-0002-8526-6013)
Institutions
- Indian Institute of Technology Kharagpur (IN)
- Technische Universität Darmstadt (DE)
- ETH Zurich (CH)
- Mahatma Gandhi Mission Institute of Health Sciences (IN)
- Indian Institute of Technology Kanpur (IN)
Publication Details
- Journal
- npj 2D Materials and Applications
- Published
- 2025-11-13
- DOI
- https://doi.org/10.1038/s41699-025-00613-w
- Primary Topic
- 2D Materials and Applications
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Indian Institute of Technology Kanpur
- Department of Science and Technology, Ministry of Science and Technology, India
- Indian Institute of Science Education and Research Pune
- Indian Institute of Science Education and Research Mohali
- Science and Engineering Research Board