Ultra-low thermal conductivity in nanoscale, epitaxial SnS grains

Thermally insulating nanoscale building blocks enable efficient routes to both passive and active heat management in miniaturized architectures. However, identifying suitable nanomaterials by computational and experimental means is difficult as critical dimensions reach the scale of thermal carriers and thermal interfaces become dominant. In this work, we propose epitaxially grown layered SnS as an outstanding thermal insulator at the thin film limit. The challenge of measuring heat transport at the nanoscale was tackled by locally probing out-of-plane thermal transport on grains of varying thickness utilizing scanning thermal microscopy. We consistently find an ultra-low thermal conductivity value of 45 mWm−1K−1, which is among the lowest reported for dense solids to date. This finding challenges previous predictions of the SnS system and opens up promising prospects for its integration into heat management components.

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Publication Details

Journal
Applied Physics Letters
Published
2025-11-10
DOI
https://doi.org/10.1063/5.0293148
Primary Topic
Thermal properties of materials
Type
article
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article

Ultra-low thermal conductivity in nanoscale, epitaxial SnS grains

Pascal Gehring, Jonathan Weaver, Clément Merckling, Francisco Molina‐Lopez et al.
Applied Physics Letters
Thermal properties of materials
article

Ultra-low thermal conductivity in nanoscale, epitaxial SnS grains

Pascal Gehring, Jonathan Weaver, Clément Merckling, Francisco Molina‐Lopez, Alessandra Canetta, Michael Rohde, Jean Spièce, Yubin Huang, Phillip S. Dobson
article en

Abstract

Thermally insulating nanoscale building blocks enable efficient routes to both passive and active heat management in miniaturized architectures. However, identifying suitable nanomaterials by computational and experimental means is difficult as critical dimensions reach the scale of thermal carriers and thermal interfaces become dominant. In this work, we propose epitaxially grown layered SnS as an outstanding thermal insulator at the thin film limit. The challenge of measuring heat transport at the nanoscale was tackled by locally probing out-of-plane thermal transport on grains of varying thickness utilizing scanning thermal microscopy. We consistently find an ultra-low thermal conductivity value of 45 mWm−1K−1, which is among the lowest reported for dense solids to date. This finding challenges previous predictions of the SnS system and opens up promising prospects for its integration into heat management components.

Applied Physics LettersVol. 127(19)
Glasgow School of Art (GB), IMEC (BE), University of Glasgow (GB), UCLouvain (BE), KU Leuven (BE)
Openalex Percentile: Top 73%
Thermal properties of materials
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