Modular Integration of Sensor-Chiplets Using Rapid Prototyping Including Interconnects and Protective Waveguide Packaging

This work addresses challenges of miniaturization and complexity in microelectronics through rapid prototyping of advanced packaging solutions. It evaluates additive manufacturing approaches to establish concrete requirements for future developments, specifically focusing on the integration of individually assembled chiplets, such as capacitive micromachined ultrasonic transducers (CMUT), in a matrix arrangement. The study examines the suitability of additive manufacturing methods regarding chiplet integration, e.g. two-photon polymerization (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathbf{2 P P}$</tex>). Results indicate that <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathbf{2 P P}$</tex> provides the necessary resolution and material characteristics. The successful implementation of a positioning cage for CMUT chiplets, along with effective contacting techniques, ensures precise alignment crucial for acoustic imaging applications. The findings underscore the importance of refining manufacturing processes and developing scalable and efficient advanced packaging solutions. Ultimately, this work aims to enable small to medium-sized companies and institutional users to leverage the advantages of chiplet-based systems, fostering innovative solutions in the evolving landscape of microelectronics.