Development of a Novel Pure-Ag-Sintering Paste for a Jet-Dispensing Process to Achieve Highest Possible Conductivity for Miniaturized Electronic Components with a Pressure-Less Sintering Process

In this work we present a new silver sintering material which can be used for the assembly of very small components via the jet-dispensing process. To validate the process stability and performance several assemblies were performed. We evaluated the thermal conductivity of the sintered paste and assembled in co-operation with the Fraunhofer IZM small dies via a pressureless sintering process to understand the cycle and long-term high-temperature storage stability of the sintered interconnects.