Investigation of RF Characteristics of Inter-Chiplet Connections for Advanced HPC Packaging Solutions

This study investigates the RF characteristics of inter-chiplet electrical connections for advanced highperformance computing (HPC) packaging solutions. To enable efficient data transfer between components in modern computing systems, we focus on the modeling and analysis of those microscale transmission lines with respect to the critical parameters as signal loss and dispersion characteristic. Measurements of the electrical characteristics up to 110 GHz at room temperature and with increased temperature up to 80°C, were performed on test chiplets as well as on PCB-assembled chiplets, confirming the modelling as well as the stability of the manufacturing processes.