Thermal design automation (TDA) for multiscale thermal management of electronics

Modern semiconductor devices face critical thermal management challenges as power densities increase and feature sizes approach deep nanoscale where classical Fourier’s heat conduction law breaks down. Traditional chip design approaches that rely primarily on only electrical designs and external cooling solutions are insufficient to address the complex, multiscale nature of thermal transport in advanced integrated circuits. This perspective presents a comprehensive Thermal Design Automation (TDA) framework, as a complementary extension to traditional Electronic Design Automation (EDA) tools, that systematically integrates thermal simulation and management methods across all length scales of semiconductor design. The TDA approach begins at the atomic scale, using first-principles calculations and lattice dynamics simulations to predict intrinsic electron and phonon transport properties. These fundamental properties parameterize phonon Monte Carlo simulations that solve the Boltzmann transport equation to capture non-Fourier heat spreading within transistors, while self-heating effects are simulated by solving fundamental semiconductor device equations. For larger scales, finite element methods and compact thermal models bridge the gap to circuit- and die-level thermal analysis and design, while advanced liquid cooling technologies address chip-level heat dissipation. Through multiscale thermal simulation and design optimization, the TDA framework enables systematic reduction of transistor heat generation, minimization of device and chip thermal resistance, and acceleration of chip design cycles, thereby enhancing overall performance and reliability. This integrated framework addresses the fundamental limitations of existing microscopic and macroscopic thermal simulation tools and establishes a new EDA+TDA paradigm for thermal-aware semiconductor design that can systematically tackle the multiscale thermal bottlenecks limiting further technological advancement in modern electronics.

Authors

Institutions

Publication Details

Journal
Journal of Applied Physics
Published
2025-11-11
DOI
https://doi.org/10.1063/5.0288828
Citations
6
Primary Topic
Thermal properties of materials
Type
article
Field-Weighted Citation Impact
3.11
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Thermal design automation (TDA) for multiscale thermal management of electronics

Bing Cao
6 citations
Journal of Applied Physics
Thermal properties of materials
3.11
article

Thermal design automation (TDA) for multiscale thermal management of electronics

Bing Cao
article en
6 citations

Abstract

Modern semiconductor devices face critical thermal management challenges as power densities increase and feature sizes approach deep nanoscale where classical Fourier’s heat conduction law breaks down. Traditional chip design approaches that rely primarily on only electrical designs and external cooling solutions are insufficient to address the complex, multiscale nature of thermal transport in advanced integrated circuits. This perspective presents a comprehensive Thermal Design Automation (TDA) framework, as a complementary extension to traditional Electronic Design Automation (EDA) tools, that systematically integrates thermal simulation and management methods across all length scales of semiconductor design. The TDA approach begins at the atomic scale, using first-principles calculations and lattice dynamics simulations to predict intrinsic electron and phonon transport properties. These fundamental properties parameterize phonon Monte Carlo simulations that solve the Boltzmann transport equation to capture non-Fourier heat spreading within transistors, while self-heating effects are simulated by solving fundamental semiconductor device equations. For larger scales, finite element methods and compact thermal models bridge the gap to circuit- and die-level thermal analysis and design, while advanced liquid cooling technologies address chip-level heat dissipation. Through multiscale thermal simulation and design optimization, the TDA framework enables systematic reduction of transistor heat generation, minimization of device and chip thermal resistance, and acceleration of chip design cycles, thereby enhancing overall performance and reliability. This integrated framework addresses the fundamental limitations of existing microscopic and macroscopic thermal simulation tools and establishes a new EDA+TDA paradigm for thermal-aware semiconductor design that can systematically tackle the multiscale thermal bottlenecks limiting further technological advancement in modern electronics.

Journal of Applied PhysicsVol. 138(18)
Tsinghua University (CN)
Openalex Percentile: Top 8%
Thermal properties of materials
3.11
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.

Thermal design automation (TDA) for multiscale thermal management of electronics — Bing Cao · Journal of Applied Physics (2025) | TGRS Research Map | TGRS