Insulation Layers on Copper Surfaces of Ceramic Circuit Boards for Smart Power Modules

First results on the development of a thick-film glass paste for manufacturing of insulating layers on copper surfaces are presented. The sintering behavior of different glasses, their processing into glass pastes and the influence of various organic vehicles on the properties of sintered glass layers are described. The paste system glass B / acrylic polymer was used to prepare dense, crack-free, and nitrogen-sinterable glass layers on copper thick-film metallization. The sintered glass layers were electrically characterized regarding insulation resistance and breakdown voltage. The measured electrical properties are compared and evaluated with the values of insulation layers of a commercial dielectric paste.