Metasurface-integrated vertical-cavity surface-emitting lasers with adaptive beam control for high-temperature stable operation

Vertical-cavity surface-emitting lasers (VCSELs) have revolutionized modern optoelectronic systems through their compact architecture and superior beam quality. Nevertheless, their inherent multimode operation induces substantial beam divergence, necessitating complex external beam-shaping components. This study presents a monolithic integration of dielectric metasurfaces with VCSELs, achieving multi-functional beam control—collimation, deflection, and beam splitting—within a footprint below 0.04 mm 2 . The proposed metasurface-integrated VCSELs (MS-VCSELs) demonstrate exceptional thermal stability in uncooled environments, with systematic characterization across a temperature range of 25°C to 150°C. Experimental results reveal temperature-insensitive beam characteristics: the far-field divergence angle variation remains below 5% (<0.1° absolute change), while the beam radius exhibits minimal thermal dependence (± μm/°C). Furthermore, we implement a scalable 10×10 beam-splitting array directly on the VCSEL aperture, generating 100 uniform optical channels with intensity uniformity exceeding 85% across the entire temperature window. Compared to conventional bulk-optics solutions, this platform reduces system volume by three orders of magnitude while eliminating active cooling requirements. These advancements position MS-VCSELs as a transformative technology for high-density optical interconnects, LiDAR systems, and distributed sensing networks operating in extreme thermal environments. The demonstrated temperature resilience, combined with wafer-scale manufacturability, addresses critical challenges in automotive, aerospace, and industrial optoelectronics where size, weight, and power constraints preclude conventional thermal management approaches.

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Publication Details

Journal
Photonics Research
Published
2025-11-10
DOI
https://doi.org/10.1364/prj.572183
Primary Topic
Semiconductor Lasers and Optical Devices
Type
article
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article

Metasurface-integrated vertical-cavity surface-emitting lasers with adaptive beam control for high-temperature stable operation

Qiang Kan, Qiuhua Wang, Jun Deng, Liyuan Liu et al.
Photonics Research
Semiconductor Lasers and Optical Devices
article

Metasurface-integrated vertical-cavity surface-emitting lasers with adaptive beam control for high-temperature stable operation

Qiang Kan, Qiuhua Wang, Jun Deng, Liyuan Liu, Xu Chen, Bo Wu, Yiyang Xie, L. Bao, Zhengtai Ma
article en

Abstract

Vertical-cavity surface-emitting lasers (VCSELs) have revolutionized modern optoelectronic systems through their compact architecture and superior beam quality. Nevertheless, their inherent multimode operation induces substantial beam divergence, necessitating complex external beam-shaping components. This study presents a monolithic integration of dielectric metasurfaces with VCSELs, achieving multi-functional beam control—collimation, deflection, and beam splitting—within a footprint below 0.04 mm 2 . The proposed metasurface-integrated VCSELs (MS-VCSELs) demonstrate exceptional thermal stability in uncooled environments, with systematic characterization across a temperature range of 25°C to 150°C. Experimental results reveal temperature-insensitive beam characteristics: the far-field divergence angle variation remains below 5% (<0.1° absolute change), while the beam radius exhibits minimal thermal dependence (± μm/°C). Furthermore, we implement a scalable 10×10 beam-splitting array directly on the VCSEL aperture, generating 100 uniform optical channels with intensity uniformity exceeding 85% across the entire temperature window. Compared to conventional bulk-optics solutions, this platform reduces system volume by three orders of magnitude while eliminating active cooling requirements. These advancements position MS-VCSELs as a transformative technology for high-density optical interconnects, LiDAR systems, and distributed sensing networks operating in extreme thermal environments. The demonstrated temperature resilience, combined with wafer-scale manufacturability, addresses critical challenges in automotive, aerospace, and industrial optoelectronics where size, weight, and power constraints preclude conventional thermal management approaches.

Photonics ResearchVol. 14(3)
Chinese Academy of Sciences (CN)
Openalex Percentile: Top 67%
Semiconductor Lasers and Optical Devices
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