Characterisation of Electro-Brush Plated Nickel Coatings on P-Type (Zr,Ti)Co(Sn,Sb) Half-Heusler Thermoelectric Materials for Stable Contact Layers

In this study, a highly conductive nickel (Ni) layer was deposited onto a P-type (Zr,Ti)Co(Sn,Sb) half-Heusler (HH) thermoelectric (TE) material using a low-cost electro-brush plating technique. Before depositing Ni on the TE material, the plating process was optimised on a stainless steel (SS) substrate. An optimal medium-rate deposition voltage of 6V was identified on the SS substrate, with the desired thickness, superior mechanical performance, reduced sheet resistance and surface roughness, and enhanced electrical conductivity. The optimised deposition condition was then applied to the P-type (Zr,Ti)Co(Sn,Sb) material, resulting in a Ni layer that significantly enhanced its electrical and thermal stability. After thermal exposure at 500 °C for 10 h, the Ni coating effectively protected the TE surface against oxidation and sublimation, suggesting that the interfacial contact properties of P-type (Zr,Ti)Co(Sn,Sb) TE material can be effectively enhanced by depositing a highly conductive, oxidation-resistant Ni layer using the cost-effective, straightforward electro-brush plating technique.

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Publication Details

Journal
Materials
Published
2025-11-10
DOI
https://doi.org/10.3390/ma18225108
Primary Topic
Advanced Thermoelectric Materials and Devices
Type
article
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article

Characterisation of Electro-Brush Plated Nickel Coatings on P-Type (Zr,Ti)Co(Sn,Sb) Half-Heusler Thermoelectric Materials for Stable Contact Layers

Zhenxue Zhang, Hanshan Dong, Mikdat Gurtaran, Xiaoying Li
Materials
Advanced Thermoelectric Materials and Devices
article

Characterisation of Electro-Brush Plated Nickel Coatings on P-Type (Zr,Ti)Co(Sn,Sb) Half-Heusler Thermoelectric Materials for Stable Contact Layers

Zhenxue Zhang, Hanshan Dong, Mikdat Gurtaran, Xiaoying Li
article en

Abstract

In this study, a highly conductive nickel (Ni) layer was deposited onto a P-type (Zr,Ti)Co(Sn,Sb) half-Heusler (HH) thermoelectric (TE) material using a low-cost electro-brush plating technique. Before depositing Ni on the TE material, the plating process was optimised on a stainless steel (SS) substrate. An optimal medium-rate deposition voltage of 6V was identified on the SS substrate, with the desired thickness, superior mechanical performance, reduced sheet resistance and surface roughness, and enhanced electrical conductivity. The optimised deposition condition was then applied to the P-type (Zr,Ti)Co(Sn,Sb) material, resulting in a Ni layer that significantly enhanced its electrical and thermal stability. After thermal exposure at 500 °C for 10 h, the Ni coating effectively protected the TE surface against oxidation and sublimation, suggesting that the interfacial contact properties of P-type (Zr,Ti)Co(Sn,Sb) TE material can be effectively enhanced by depositing a highly conductive, oxidation-resistant Ni layer using the cost-effective, straightforward electro-brush plating technique.

MaterialsVol. 18(22)
Izmir Institute of Technology (TR), University of Birmingham (GB)
Openalex Percentile: Top 73%
Advanced Thermoelectric Materials and Devices
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