High-performance dynamic random access memory capacitor with an equivalent oxide thickness of 0.31 nm <i>via</i> stepwise cycling in Y-doped Hf <sub>0.5</sub> Zr <sub>0.5</sub> O <sub>2</sub> thin films

This study investigates the field-induced ferroelectric (FFE) characteristics and dynamic random access memory (DRAM) performance of Y-doped Hf<sub>0.5</sub>Zr<sub>0.5</sub>O<sub>2</sub> (Y:Hf<sub>0.5</sub>Zr<sub>0.5</sub>O<sub>2</sub>) thin films grown by atomic layer deposition (ALD). Compared with undoped Hf<sub>0.5</sub>Zr<sub>0.5</sub>O<sub>2</sub>, the Y:Hf<sub>0.5</sub>Zr<sub>0.5</sub>O<sub>2</sub> film exhibited suppressed ferroelectric orthorhombic phase and stabilized FFE tetragonal phase, resulting in double hysteresis loop characteristics in the polarization-electric field curves. These changes were attributed to substitutional diffusion of Y ions introduced by a single ALD cycle of Y<sub>2</sub>O<sub>3</sub> inserted in the middle of the film. However, the onset field of the FFE effect from the pristine film was too high for DRAM application. To address this issue, a stepwise cycling method was proposed, consisting of an initial short high-field cycling step (6 MV cm<sup>-1</sup>, 10<sup>5</sup> cycles, 1 second) followed by subsequent cycles at gradually decreased field amplitudes (5 MV cm<sup>-1</sup>, 10<sup>5</sup> cycles, 1 second → 4 MV cm<sup>-1</sup>, 10<sup>7</sup> cycles, 100 seconds). This approach effectively shifted the FFE switching peaks toward lower fields, enabling charge boosting at low voltage (±0.8 V) while minimizing increases in remanent polarization and leakage current density (<i>J</i>). Consequently, the stepwise cycled 5.5-nm-thick Y:Hf<sub>0.5</sub>Zr<sub>0.5</sub>O<sub>2</sub> film achieved a high dielectric permittivity (<i>k</i>) of ∼68 and a record-low equivalent oxide thickness (EOT) of ∼0.31 nm among dielectric thin films satisfying the DRAM <i>J</i> criterion (<i>J</i> < 10<sup>-7</sup> A cm<sup>-2</sup> at 0.8 V). The substantial EOT reduction with stepwise cycling was enabled by the low-voltage charge-boosting effect, which enhanced the field-induced polarization response. These improvements were attributed to dopant-induced local structural inhomogeneity and effective redistribution of double positively charged oxygen vacancies. The EOT values were sustained with only slight degradation over 10<sup>9</sup> cycles of 0.8 V operation and fully recovered after short high-field cycling.

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Journal
Materials Horizons
Published
2025-11-07
DOI
https://doi.org/10.1039/d5mh01563d
Primary Topic
Ferroelectric and Negative Capacitance Devices
Type
article
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article

High-performance dynamic random access memory capacitor with an equivalent oxide thickness of 0.31 nm via stepwise cycling in Y-doped Hf 0.5 Zr 0.5 O 2 thin films

Haewon Song, Kyung Do Kim, Heewon Paik, Jonghoon Shin et al.
Materials Horizons
Ferroelectric and Negative Capacitance Devices
article

High-performance dynamic random access memory capacitor with an equivalent oxide thickness of 0.31 nm via stepwise cycling in Y-doped Hf 0.5 Zr 0.5 O 2 thin films

Haewon Song, Kyung Do Kim, Heewon Paik, Jonghoon Shin, Cheol Seong Hwang, Seong Jae Shin, Jae Hee Song, Jaesoon Choi, Han-Sub Yoon, Haengha Seo, Han Sol Park, Janguk Han, Dong‐Hoon Shin, Sanghyup Lee, Tae Kyun Kim, Seungheon Choi
article en

Abstract

This study investigates the field-induced ferroelectric (FFE) characteristics and dynamic random access memory (DRAM) performance of Y-doped Hf<sub>0.5</sub>Zr<sub>0.5</sub>O<sub>2</sub> (Y:Hf<sub>0.5</sub>Zr<sub>0.5</sub>O<sub>2</sub>) thin films grown by atomic layer deposition (ALD). Compared with undoped Hf<sub>0.5</sub>Zr<sub>0.5</sub>O<sub>2</sub>, the Y:Hf<sub>0.5</sub>Zr<sub>0.5</sub>O<sub>2</sub> film exhibited suppressed ferroelectric orthorhombic phase and stabilized FFE tetragonal phase, resulting in double hysteresis loop characteristics in the polarization-electric field curves. These changes were attributed to substitutional diffusion of Y ions introduced by a single ALD cycle of Y<sub>2</sub>O<sub>3</sub> inserted in the middle of the film. However, the onset field of the FFE effect from the pristine film was too high for DRAM application. To address this issue, a stepwise cycling method was proposed, consisting of an initial short high-field cycling step (6 MV cm<sup>-1</sup>, 10<sup>5</sup> cycles, 1 second) followed by subsequent cycles at gradually decreased field amplitudes (5 MV cm<sup>-1</sup>, 10<sup>5</sup> cycles, 1 second → 4 MV cm<sup>-1</sup>, 10<sup>7</sup> cycles, 100 seconds). This approach effectively shifted the FFE switching peaks toward lower fields, enabling charge boosting at low voltage (±0.8 V) while minimizing increases in remanent polarization and leakage current density (<i>J</i>). Consequently, the stepwise cycled 5.5-nm-thick Y:Hf<sub>0.5</sub>Zr<sub>0.5</sub>O<sub>2</sub> film achieved a high dielectric permittivity (<i>k</i>) of ∼68 and a record-low equivalent oxide thickness (EOT) of ∼0.31 nm among dielectric thin films satisfying the DRAM <i>J</i> criterion (<i>J</i> < 10<sup>-7</sup> A cm<sup>-2</sup> at 0.8 V). The substantial EOT reduction with stepwise cycling was enabled by the low-voltage charge-boosting effect, which enhanced the field-induced polarization response. These improvements were attributed to dopant-induced local structural inhomogeneity and effective redistribution of double positively charged oxygen vacancies. The EOT values were sustained with only slight degradation over 10<sup>9</sup> cycles of 0.8 V operation and fully recovered after short high-field cycling.

Materials HorizonsVol. 13(4)
Seoul National University (KR), National University College (PR)
Openalex Percentile: Top 67%
Ferroelectric and Negative Capacitance Devices
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