Measurement-based analysis of packaged X-Hall current sensors for automotive applications

This work presents a comprehensive experimental evaluation of X-Hall broadband current sensors, addressing system-level performance and measurement challenges relevant to modern power electronics. Two sensor versions (CH09 and CH10), fabricated using STMicroelectronics BCD10 process and packaged in ceramic (CLCC) and plastic (QFN) carriers, are analyzed in both high- and low-gain modes. The study examines the influence of process variation, packaging, and temperature on the static behavior of the sensors, while dynamic performance is characterized through small-signal frequency sweeps and large-signal step responses under both internal current and external magnetic field excitations. The most promising configuration—CH10 in the QFN package operating in low-gain mode—achieves an input-referred noise of 0.17 mT, a 1-dB compression range of 172 mT (60 dB dynamic range), with sensitivity and offset temperature dependencies of 0 . 61 %/K and 0 . 11 %/K , respectively. This configuration is further validated through preliminary integration into a silicon carbide (SiC) traction inverter and comparison with commercial alternatives. • Two Hall sensor versions in two package types are experimentally characterized. • Sensitivity and offset are analyzed for process spread and temperature dependence. • Noise and saturation are measured to define the dynamic range. • Dynamic tests include broadband frequency sweep and large-signal step response. • Sensor with magnetic concentrator is configured for use in a SiC traction inverter.