Mechanical Layout Optimization for Curvy Conformal Electronics With Multilayered Structures

Abstract Curvy conformal electronics offer broad application potential by integrating diverse multilayered structural components onto target curvy surfaces. The layout design of multilayered structures is crucial for ensuring mechanical reliability. However, there are relatively few studies that have addressed the mechanical layout design for curvy conformal electronics. Here, a theoretical model of the multilayered structure with extremely different elastic properties is established under bending deformation. Theoretical predictions of strain distribution show good agreement with finite element analysis (FEA) results. Furthermore, a mechanical layout optimization guideline is developed for curvy conformal electronics to minimize the stress in ultra-thin chips. The proposed mechanical layout optimization strategy is implemented on various target curvy surfaces to demonstrate its feasibility. This work provides practical insights into the layout design of curvy conformal electronics for enhanced mechanical reliability.