Low-Temperature Layer-by-Layer Epitaxy of Ferroelectric Al <sub>0.63</sub> Sc <sub>0.37</sub> N Thin Films for Back-End-of-Line Integration

Sc-doped aluminum nitride ((Al,Sc)N) is a promising material for next-generation nonvolatile memory and MEMS applications for its robust ferroelectricity and CMOS compatibility. However, the large coercive field remains the roadblock. Acquiring high Sc content-doped (Al,Sc)N epitaxial thin films is essential to reduce the coercive field but remains challenging, especially at low temperature for back-end-of-line (BEOL) integration. Here we demonstrate the layer-by-layer epitaxial growth of ferroelectric Al<sub>0.63</sub>Sc<sub>0.37</sub>N thin films (highest Sc content in epitaxial films) at 400 °C by developing a nitrogen-plasma-assisted pulsed laser deposition (N-PLD) technique. Verified by X-ray photoelectron spectroscopy analysis, the atomic nitrogen atmosphere is crucial to suppress nitrogen vacancies and stabilize the high Sc content (Al,Sc)N wurtzite phase. The high-quality epitaxial Al<sub>0.63</sub>Sc<sub>0.37</sub>N thin films show high remanent polarization >160 μC cm<sup>-2</sup> and desirable low coercive field of ∼2.9 MV cm<sup>-1</sup>. Our results open a new pathway for high-quality (Al,Sc)N BEOL integration for nonvolatile memory and MEMS applications.

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Publication Details

Journal
Nano Letters
Published
2025-11-05
DOI
https://doi.org/10.1021/acs.nanolett.5c04014
Citations
1
Primary Topic
Acoustic Wave Resonator Technologies
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article
Field-Weighted Citation Impact
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article

Low-Temperature Layer-by-Layer Epitaxy of Ferroelectric Al 0.63 Sc 0.37 N Thin Films for Back-End-of-Line Integration

Mingqiang Cheng, Dirui Wu, Changjian Li, Jiangyu Li et al.
1 citations
Nano Letters
Acoustic Wave Resonator Technologies
0.67
article

Low-Temperature Layer-by-Layer Epitaxy of Ferroelectric Al 0.63 Sc 0.37 N Thin Films for Back-End-of-Line Integration

Mingqiang Cheng, Dirui Wu, Changjian Li, Jiangyu Li, Zihao Lin, Shuhua Ma, Weinan Chen, Z. S. Zou, Chao Li
article en
1 citations

Abstract

Sc-doped aluminum nitride ((Al,Sc)N) is a promising material for next-generation nonvolatile memory and MEMS applications for its robust ferroelectricity and CMOS compatibility. However, the large coercive field remains the roadblock. Acquiring high Sc content-doped (Al,Sc)N epitaxial thin films is essential to reduce the coercive field but remains challenging, especially at low temperature for back-end-of-line (BEOL) integration. Here we demonstrate the layer-by-layer epitaxial growth of ferroelectric Al<sub>0.63</sub>Sc<sub>0.37</sub>N thin films (highest Sc content in epitaxial films) at 400 °C by developing a nitrogen-plasma-assisted pulsed laser deposition (N-PLD) technique. Verified by X-ray photoelectron spectroscopy analysis, the atomic nitrogen atmosphere is crucial to suppress nitrogen vacancies and stabilize the high Sc content (Al,Sc)N wurtzite phase. The high-quality epitaxial Al<sub>0.63</sub>Sc<sub>0.37</sub>N thin films show high remanent polarization >160 μC cm<sup>-2</sup> and desirable low coercive field of ∼2.9 MV cm<sup>-1</sup>. Our results open a new pathway for high-quality (Al,Sc)N BEOL integration for nonvolatile memory and MEMS applications.

Nano LettersVol. 25(46)
ON Semiconductor (United States) (US), Harbin Institute of Technology (CN), Southern University of Science and Technology (CN), Global Communication Semiconductors (United States) (US)
Openalex Percentile: Top 25%
Acoustic Wave Resonator Technologies
0.67
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Low-Temperature Layer-by-Layer Epitaxy of Ferroelectric Al <sub>0.63</sub> Sc <sub>0.37</sub> N Thin Films for Back-End-of-Line Integration — Mingqiang Cheng, Dirui Wu, et al. · Nano Letters (2025) | TGRS Research Map | TGRS