Computational‐Efficient IGBT and Diode Thermal Modelling Methodology With High Accuracy

ABSTRACT In an industrial context where high reliability is an increasingly important requirement, thermal modelling of power semiconductors becomes necessary for diagnostics and prognostics. This paper proposes a simulation‐based methodology that can estimate junction temperatures in insulated gate bipolar transistors and diodes much faster than conventional methods with an improved accuracy. The approach is based on a combination of conventional steady state simulation techniques with a post‐processing stage. The analysis is carried out by first calculating the conduction and switching losses and then obtaining the junction temperature by using the device thermal network. The obtained results (including both simulations and experiments) are compared to state‐of‐the‐art methods, highlighting the accuracy of the proposed method.

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Publication Details

Journal
IET Power Electronics
Published
2025-01-01
DOI
https://doi.org/10.1049/pel2.70143
Citations
1
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
0.73

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article

Computational‐Efficient IGBT and Diode Thermal Modelling Methodology With High Accuracy

Giampaolo Buticchi, Samir Kouro, Christian A. Rojas, José I. Leon et al.
1 citations
IET Power Electronics
Silicon Carbide Semiconductor Technologies
0.73
article

Computational‐Efficient IGBT and Diode Thermal Modelling Methodology With High Accuracy

Giampaolo Buticchi, Samir Kouro, Christian A. Rojas, José I. Leon, Ciro Alosa, Ricardo Lizana, Fabio Immovilli, Alejandro Stowhas‐Villa, Abraham Marquez, Jhonattan G. Berger
article en
1 citations

Abstract

ABSTRACT In an industrial context where high reliability is an increasingly important requirement, thermal modelling of power semiconductors becomes necessary for diagnostics and prognostics. This paper proposes a simulation‐based methodology that can estimate junction temperatures in insulated gate bipolar transistors and diodes much faster than conventional methods with an improved accuracy. The approach is based on a combination of conventional steady state simulation techniques with a post‐processing stage. The analysis is carried out by first calculating the conduction and switching losses and then obtaining the junction temperature by using the device thermal network. The obtained results (including both simulations and experiments) are compared to state‐of‐the‐art methods, highlighting the accuracy of the proposed method.

IET Power ElectronicsVol. 18(1)
University of Modena and Reggio Emilia (IT), University of Nottingham Ningbo China (CN), Harbin Institute of Technology (CN), Universidad Católica de la Santísima Concepción (CL), Renewable Energy Systems (United States) (US), Federico Santa María Technical University (CL), Universidad de Sevilla (ES)
Ministerio de Ciencia e Innovación, Junta de Andalucía, Agencia Nacional de Investigación y Desarrollo, European Regional Development Fund, Agencia Estatal de Investigación, Fondo de Financiamiento de Centros de Investigación en Áreas Prioritarias
Openalex Percentile: Top 22%
Silicon Carbide Semiconductor Technologies
0.73
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