Hot Deformation Behavior and Dynamic Recrystallization Mechanism of GH3230 Superalloy

An isothermal hot compression test of GH3230 was carried out under deformation conditions with deformation temperatures ranging from 1020 to 1110 °C and strain rates ranging from 1 to 0.001 s−1. On this basis, the corresponding constitutive equation of the alloy was established. ε˙=exp36.123sinh0.00587σ4.7946exp−451.507/RT. At the same time, a power dissipation diagram and thermal processing diagram were created. The peak value η can reach 0.36, and the optimum hot working parameter window of the GH3230 superalloy is 1020~1110 °C/0.1~0.001 s−1. The microstructure evolution of the alloy under different conditions was studied by EBSD. With an increase in deformation temperature and a decrease in strain rate, the grain size significantly improved; the average grain size of the GH3230 alloy increased from 16.86 to 35.06 μm, and the degree of recrystallization of the alloy also improved. The maximum recrystallization volume fraction is 75.2%. At low temperature and high strain rate, the recrystallization mechanism of the microstructure is mainly CDRX, and DDRX is the auxiliary mechanism. At high temperature and low strain rate, the main corresponding recrystallization mechanism gradually transforms into DDRX.