Detection of Silicone Contamination using Raman Spectroscopy in Adhesive Bond Failures

Abstract This article describes a case study in which adhesive failures were observed in smart camera assemblies during production. The analysis demonstrated that Raman spectroscopy enables rapid, nondestructive detection of silicone contamination in camera assemblies, enhancing failure analysis and improving manufacturing reliability.

Authors

Aravinda Bommareddy (ORCID: https://orcid.org/0000-0001-7827-9070)

Institutions

ESI Group (United States) (US)

Publication Details

Journal: AM&P Technical Articles
Published: 2025-10-01
DOI: https://doi.org/10.31399/asm.amp.2025-07.p026
Primary Topic: Thermography and Photoacoustic Techniques
Type: article
Field-Weighted Citation Impact: 0.00

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article

Detection of Silicone Contamination using Raman Spectroscopy in Adhesive Bond Failures

Aravinda Bommareddy

Oct 1, 2025

AM&P Technical Articles

Thermography and Photoacoustic Techniques

article

Detection of Silicone Contamination using Raman Spectroscopy in Adhesive Bond Failures

Aravinda Bommareddy

October 1, 2025article en

Abstract

AM&P Technical ArticlesVol. 183(7)

ESI Group (United States) (US)

Openalex Percentile: Top 63%

Thermography and Photoacoustic Techniques

DOI Source OpenAlex

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Detection of Silicone Contamination using Raman Spectroscopy in Adhesive Bond Failures — Aravinda Bommareddy · AM&P Technical Articles (2025) | TGRS Research Map | TGRS