Review on the Potential Suitability of BaTiO ₃ Ceramics Prepared by Spark Plasma Sintering for Integration into Power Electronic Modules: A Focus on Dielectric Properties and Breakdown Field Strength

The demand for compact and efficient power electronic devices, particularly in rail transport and aeronautics, drives the development of high-power modules capable of handling higher levels of voltages (>1 kV) and currents (>100 A). Advances in semiconductor technology, particularly the shift from silicon (Si) to silicon carbide (SiC) chips, introduces more challenges for packaging design. Thus, it highlights the increasing need to integrate decoupling capacitors into the power electronic module. Integrating a capacitor close to the switching device is desirable, as it improves the switching performance. Nevertheless, capacitor integration is a challenge to overcome. Consequently, optimized and functionalized packages are required to support this integration into the ceramic substrate of power electronic modules. Ceramic capacitors are promising candidates for this integration due to their inherently rigid mechanical structure. This paper aims to describe the constraints and requirements for capacitor material integration, with a particular focus on dielectric characteristics and electrical breakdown field strength. The electrical properties of undoped barium titanate shaped by spark plasma sintering in correlation with the elaboration process are discussed. Finally, the potential for integration into power electronic modules is assessed.