Enhanced transport properties in GaN heterostructures with sputter-epitaxy-grown ScAlN barriers via thermal annealing

ScAlN has attracted considerable attention as a promising barrier material in GaN-based high-electron-mobility transistors. However, few studies have been conducted on the effect of thermal annealing on the structural, electrical, and transport properties of ScAlN barrier layer sputter-deposited on an AlGaN/AlN/GaN heterostructure. Therefore, in this study, ScAlN barrier layers were grown by sputter epitaxy on templates prepared via metalorganic vapor phase deposition. Post-deposition annealing was conducted at 750 °C, which preserved the wurtzite structure of the ScAlN films and maintained coherent interfaces without interdiffusion or phase change. Hall effect measurements revealed that annealing substantially increased the sheet carrier concentration (∼8.0×1012cm−2) and electron mobility exceeding 1000 cm2 V−1 s−1 of the heterostructure. The mobility was limited by acoustic deformation potential, polar optical phonon, and interface roughness scattering. Notably, the increased roughness scattering at higher Sc content might be due to local compositional fluctuations. These results demonstrate that thermal annealing effectively enhances the transport properties of ScAlN barrier layers sputter-deposited on GaN-based heterostructures, offering a promising route for fabricating high-performance and scalable GaN-based electronic devices.

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Publication Details

Journal
Applied Physics Letters
Published
2025-11-03
DOI
https://doi.org/10.1063/5.0294172
Citations
1
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
1.26
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article

Enhanced transport properties in GaN heterostructures with sputter-epitaxy-grown ScAlN barriers via thermal annealing

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1 citations
Applied Physics Letters
GaN-based semiconductor devices and materials
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article

Enhanced transport properties in GaN heterostructures with sputter-epitaxy-grown ScAlN barriers via thermal annealing

S. Tōyama, Takuya Maeda, Takahiko Kawahara, K. Kubota, Atsushi Kobayashi, Takehito Seki, Naoya Shibata, Ken Nakata, Kazuhisa Ikeda, Kozo Makiyama, Yusuke Wakamoto, Shinsuke Hashimoto, Tomoya Okuda, Shunsuke Ota
article en
1 citations

Abstract

ScAlN has attracted considerable attention as a promising barrier material in GaN-based high-electron-mobility transistors. However, few studies have been conducted on the effect of thermal annealing on the structural, electrical, and transport properties of ScAlN barrier layer sputter-deposited on an AlGaN/AlN/GaN heterostructure. Therefore, in this study, ScAlN barrier layers were grown by sputter epitaxy on templates prepared via metalorganic vapor phase deposition. Post-deposition annealing was conducted at 750 °C, which preserved the wurtzite structure of the ScAlN films and maintained coherent interfaces without interdiffusion or phase change. Hall effect measurements revealed that annealing substantially increased the sheet carrier concentration (∼8.0×1012cm−2) and electron mobility exceeding 1000 cm2 V−1 s−1 of the heterostructure. The mobility was limited by acoustic deformation potential, polar optical phonon, and interface roughness scattering. Notably, the increased roughness scattering at higher Sc content might be due to local compositional fluctuations. These results demonstrate that thermal annealing effectively enhances the transport properties of ScAlN barrier layers sputter-deposited on GaN-based heterostructures, offering a promising route for fabricating high-performance and scalable GaN-based electronic devices.

Applied Physics LettersVol. 127(18)
Tokyo University of Information Sciences (JP), Tokyo University of Science (JP), Sumitomo Electric Industries (United States) (US), Japan Fine Ceramics Center (JP), Sumitomo Electric Industries (Japan) (JP), The University of Tokyo (JP)
Openalex Percentile: Top 16%
GaN-based semiconductor devices and materials
1.26
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