Solution‐Based 3D Printing of Thermoelectrics: Advances and Opportunities
Conformal and flexible thermoelectric devices, capable of adapting to complex heat sources, are essential for advancing practical thermoelectric applications in energy harvesting and thermal management. Solution-based 3D printing has emerged as a promising additive manufacturing technique for thermoelectrics, offering advantages such as ambient-temperature processing, geometric precision, material versatility, and scalability for mass customization. This review highlights recent progress in conformal and flexible thermoelectric materials and devices fabricated via solution 3D printing, with a systematic focus on ink formulations, material and device architectures, performance metrics, and real-world applications. It also discusses current challenges, future directions, and emerging opportunities. This work aims to inform the design and scalable fabrication of high-performance, flexible, and adaptable thermoelectric systems.
Authors
- Xiao‐Lei Shi (ORCID: https://orcid.org/0000-0003-0905-2547)
- Yong Du (ORCID: https://orcid.org/0000-0002-7981-6373)
- Minzhi Du (ORCID: https://orcid.org/0009-0004-5717-8632)
- Zhi‐Gang Chen (ORCID: https://orcid.org/0000-0002-9309-7993)
- Ting Zhang (ORCID: https://orcid.org/0000-0001-5008-2081)
Institutions
- Nanjing University of Chinese Medicine (CN)
- Queensland University of Technology (AU)
- Chinese Academy of Sciences (CN)
- Nanjing Institute of Technology (CN)
- Institute of Engineering Thermophysics (CN)
- University of Chinese Academy of Sciences (CN)
- Shanghai Institute of Technology (CN)
Publication Details
- Journal
- Advanced Science
- Published
- 2025-11-03
- DOI
- https://doi.org/10.1002/advs.202514259
- Primary Topic
- Advanced Thermoelectric Materials and Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00