ASA Sizing Technology Based on High Shear Homogenizer System

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Journal
JAPAN TAPPI JOURNAL
Published
2025-01-01
DOI
https://doi.org/10.2524/jtappij.79.910
Primary Topic
Epoxy Resin Curing Processes
Type
article
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article

ASA Sizing Technology Based on High Shear Homogenizer System

J. H. Lee, Keisuke Iriyama
JAPAN TAPPI JOURNAL
Epoxy Resin Curing Processes
article

ASA Sizing Technology Based on High Shear Homogenizer System

J. H. Lee, Keisuke Iriyama
article en

Abstract

No abstract available for this paper.
JAPAN TAPPI JOURNALVol. 79(10)
Korea Electric Power Corporation (South Korea) (KR), Kemira (Finland) (FI)
Openalex Percentile: Top 67%
Epoxy Resin Curing Processes
DOISourceOpenAlex
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ASA Sizing Technology Based on High Shear Homogenizer System — J. H. Lee, Keisuke Iriyama · JAPAN TAPPI JOURNAL (2025) | TGRS Research Map | TGRS