Enhanced thermal and mechanical performance of epoxy composites via three-dimensional boron nitride nanostructures

To improve the comprehensive performance of electronic packaging materials and meet the needs of more scenarios, boron nitride three-dimensional nanostructure (3D BN) was introduced in epoxy resin (EP) composites. In comparison with EP composites, the BN/EP composites show much better thermal performance. Infrared imaging analysis shows that the total cooling time of BN/EP composite is 56 s faster than that of EP. These results are matched with thermal conductivity and thermal diffusion information. The presence of the thermal conductive filler helps the complex's internal heat to dissipate swiftly without accumulating in the matrix, thereby improving thermal stability. The BN/EP composites have a higher thermal expansion coefficient than EP at high temperatures. By tailoring the coefficient of thermal expansion, composites can be endowed with expanded functionalities and more sophisticated, application-specific designs. The incorporation of flexible fillers weakens the interfacial bonding, endowing the composite with enhanced plastic-deformation capacity and thereby preventing brittle fracture in the BN/EP system. The work provides a reference for further exploration of 3D BN modified EP composites.