Analysis of Thermal Fatigue Behavior and Interface Optimization Design for Laminated Tungsten Plasma-Facing Material Under Steady-State Thermal Load

Plasma-facing components (PFCs) are among the most critical functional components in a nuclear fusion device. Their reliability and durability under high heat loads are directly tied to the safe operation and lifetime of the fusion device. Under cyclic high thermal loads, accumulated plastic strain can lead to material property degradation. Furthermore, severe temperature gradients generate alternating tensile and compressive stresses within the material, resulting in the initiation and propagation of microcracks, ultimately causing structural failure of the PFCs. This study focuses on the issues of thermal stress concentration and plastic strain accumulation at the tungsten (W)/copper (Cu) joint interface and proposes an optimized design scheme based on a laminated tungsten structure. Using a combined approach of finite element simulation and theoretical analysis, the effects of tungsten layer thickness and interface geometry on the thermomechanical performance of the PFC joint were systematically investigated. The results indicate that reducing the thickness of tungsten sheet can significantly decrease the interfacial stress level. As the tungsten sheet thickness is reduced from the millimeter scale to the micrometer scale, the thermal mismatch at the W/Cu interface is reduced, thereby leading to a notable reduction in normal stress along the axial direction. In particular, when the thickness falls below 10 μm, the axial normal stress approaches zero, and the equivalent stress at the interface is effectively mitigated. Further research indicates that optimizing the flat W/Cu interface into an arc-shaped interface can alter the location of stress concentration. When the ascending distance of the Cu exceeds 600 μm, the stress concentration at the interface vertex is essentially eliminated. However, an excessively ascending distance of the Cu can exacerbate plastic deformation in the copper layer. By optimizing the extended distance of the Cu, a balance between stress relief and plastic strain accumulation can be effectively achieved.