Simulation Study on the Effect of Growth Pressure on Growth Rate of GaN

During the preparation of gallium nitride (GaN) single crystals by Hydride Vapor Phase Epitaxy (HVPE), variations in growth pressure within the reaction chamber can easily lead to a mismatch between vapor transport dynamics and surface reaction processes, thereby affecting crystal growth rate and uniformity. To address this issue, this study established a multi-physics coupled simulation model based on the HVPE equipment structure. By integrating reaction gas flow, heat transfer, chemical reactions, and mass transport mechanisms, systematic finite element analysis was employed to simulate the flow field distribution, thermal field stability, and precursor concentration field evolution within the reaction chamber under different growth pressures (91-141 kPa). The simulation results indicate that, on one hand, the growth rate exhibits a nearly linear increase trend with rising pressure. At lower pressures (<100 kPa), vapor transport is limited, leading to a significant decrease in growth rate, while at higher pressures (>110 kPa), growth uniformity deteriorates. Optimizing the pressure parameter can enhance both the growth rate and thickness uniformity of GaN single crystals, providing a basis for process control in the preparation of high-performance GaN devices.

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Publication Details

Journal
Materials
Published
2025-10-29
DOI
https://doi.org/10.3390/ma18214941
Citations
1
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
1.26

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Simulation Study on the Effect of Growth Pressure on Growth Rate of GaN

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Simulation Study on the Effect of Growth Pressure on Growth Rate of GaN

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article en
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Abstract

During the preparation of gallium nitride (GaN) single crystals by Hydride Vapor Phase Epitaxy (HVPE), variations in growth pressure within the reaction chamber can easily lead to a mismatch between vapor transport dynamics and surface reaction processes, thereby affecting crystal growth rate and uniformity. To address this issue, this study established a multi-physics coupled simulation model based on the HVPE equipment structure. By integrating reaction gas flow, heat transfer, chemical reactions, and mass transport mechanisms, systematic finite element analysis was employed to simulate the flow field distribution, thermal field stability, and precursor concentration field evolution within the reaction chamber under different growth pressures (91-141 kPa). The simulation results indicate that, on one hand, the growth rate exhibits a nearly linear increase trend with rising pressure. At lower pressures (<100 kPa), vapor transport is limited, leading to a significant decrease in growth rate, while at higher pressures (>110 kPa), growth uniformity deteriorates. Optimizing the pressure parameter can enhance both the growth rate and thickness uniformity of GaN single crystals, providing a basis for process control in the preparation of high-performance GaN devices.

MaterialsVol. 18(21)
Qilu University of Technology (CN), Shandong University (CN), Crystal Research (United States) (US), Jinan Institute of Quantum Technology (CN), Shandong Academy of Sciences (CN), State Key Laboratory of Crystal Materials
Shandong University, State Key Laboratory of Crystal Materials, National Natural Science Foundation of China, Natural Science Foundation of Shandong Province
Openalex Percentile: Top 16%
GaN-based semiconductor devices and materials
1.26
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