Effects of bismuth on the microstructure and crack propagation in Sn–Ag–Cu-Bi solder joints during thermal cycling
Authors
- Richard Coyle (ORCID: https://orcid.org/0000-0003-3396-1337)
- Jingwei Xian (ORCID: https://orcid.org/0000-0003-1464-9292)
- Chen-Lin Hsieh (ORCID: https://orcid.org/0000-0003-0686-8794)
- S. Belyakov (ORCID: https://orcid.org/0000-0002-0957-4268)
- C.M. Gourlay (ORCID: https://orcid.org/0000-0002-4588-6007)
Institutions
- Murray State University (US)
- Imperial College London (GB)
Publication Details
- Journal
- Journal of Materials Science Materials in Electronics
- Published
- 2025-10-01
- DOI
- https://doi.org/10.1007/s10854-025-15979-2
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Imperial College London
- Engineering and Physical Sciences Research Council