Study of the Ultrafine-Grained Copper Structure Formed by Dynamic Recrystallization by Analyzing the Etched Surface Relief
The ultrafine-grained structure of technically pure copper formed by severe plastic deformation is investigated by estimating the state of the structure, including the spatial distribution of grain boundary energies. The peculiarities of relaxation processes at the final stage of deformation are established.
Authors
- I. V. Blinov (ORCID: https://orcid.org/0000-0002-4126-9351)
- A. V. Stolbovsky (ORCID: https://orcid.org/0000-0001-5228-7857)
- N. S. Chikunova
Institutions
- M.N. Mikheev Institute of Metal Physics (RU)
Publication Details
- Journal
- Bulletin of the Russian Academy of Sciences Physics
- Published
- 2025-10-01
- DOI
- https://doi.org/10.1134/s1062873825713091
- Primary Topic
- Microstructure and mechanical properties
- Type
- article
- Field-Weighted Citation Impact
- 0.00