Scientific Machine Learning (SciML) - How the Fusion of AI and Physics is Giving Rise to Promising Simulation Methodologies

The combination of physical modeling and machine learning, known as Scientific Machine Learning (SciML), is enabling a new generation of simulation methodologies. In this work, we demonstrate the potential of SciML for simulating silicide formation in Ni-SiC systems, a process highly relevant to TCAD and device engineering. Four neural network architectures - standard MLPs, enhanced mMLPs with residual connections, interpretable Kolmogorov-Arnold Networks (KANs), and Chebyshev KANs (cKANs) - are benchmarked, each trained solely on the governing physical laws. All models tested achieve accurate results and enable rapid evaluation, providing large speedups over traditional solvers. Among these, the mMLP yields the best accuracy. These findings underscore the strong potential of SciML for efficient and accurate TCAD simulations, paving the way for scalable, data-integrated modeling of complex material interactions in semiconductor technology.

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Publication Details

Published
2025-09-24
DOI
https://doi.org/10.1109/sispad66650.2025.11186115
Citations
1
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
0.73
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article

Scientific Machine Learning (SciML) - How the Fusion of AI and Physics is Giving Rise to Promising Simulation Methodologies

Xinghua Cheng, Andreas Roßkopf, Daniel Tenbrinck, C. Straub
1 citations
Silicon Carbide Semiconductor Technologies
0.73
article

Scientific Machine Learning (SciML) - How the Fusion of AI and Physics is Giving Rise to Promising Simulation Methodologies

Xinghua Cheng, Andreas Roßkopf, Daniel Tenbrinck, C. Straub
article en
1 citations

Abstract

The combination of physical modeling and machine learning, known as Scientific Machine Learning (SciML), is enabling a new generation of simulation methodologies. In this work, we demonstrate the potential of SciML for simulating silicide formation in Ni-SiC systems, a process highly relevant to TCAD and device engineering. Four neural network architectures - standard MLPs, enhanced mMLPs with residual connections, interpretable Kolmogorov-Arnold Networks (KANs), and Chebyshev KANs (cKANs) - are benchmarked, each trained solely on the governing physical laws. All models tested achieve accurate results and enable rapid evaluation, providing large speedups over traditional solvers. Among these, the mMLP yields the best accuracy. These findings underscore the strong potential of SciML for efficient and accurate TCAD simulations, paving the way for scalable, data-integrated modeling of complex material interactions in semiconductor technology.

Friedrich-Alexander-Universität Erlangen-Nürnberg (DE), Fraunhofer Institute for Integrated Circuits (DE), Fraunhofer Institute for Integrated Systems and Device Technology (DE)
Openalex Percentile: Top 22%
Silicon Carbide Semiconductor Technologies
0.73
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Scientific Machine Learning (SciML) - How the Fusion of AI and Physics is Giving Rise to Promising Simulation Methodologies — Xinghua Cheng, Andreas Roßkopf, et al. · (2025) | TGRS Research Map | TGRS