Cobalt interconnect integration: progress in metal deposition, chemical mechanical polishing, and post-CMP cleaning for advanced technology nodes
This review systematically analyzes the deposition, chemical mechanical planarization (CMP), and post-CMP cleaning (PCMPC) processes for cobalt interconnect structures in advanced technology nodes of integrated circuits.
Authors
- Baimei Tan (ORCID: https://orcid.org/0000-0003-3498-4143)
- Shihao Zhang (ORCID: https://orcid.org/0000-0003-0467-2544)
- Fangyuan Wang (ORCID: https://orcid.org/0009-0004-0536-2382)
Institutions
- Hebei University of Technology (CN)
Publication Details
- Journal
- Journal of Materials Chemistry C
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1039/d5tc02573g
- Primary Topic
- Advanced Surface Polishing Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00