Mechanical properties of intermetallic compounds at solder joint interfaces investigated using nanoindentation technique

Nanoindentation technique is applied as the key tool to investigated mechanical properties of intermetallic compounds, particularly those formed at solder joint interfaces, which are essential for the mechanical stability and reliability of electronic packaging. This article reviews the findings on mechanical properties of various intermetallic compounds using nanoindentation, including the dependences of crystal orientation and structure, alloying effects, and how these influence hardness, Young’s modulus, plastic ability, and creep resistance. Young’s modulus/hardness ratio was proposed to evaluate toughness, and creep resistance, and to predict reliability of the joints. The reviews shed a brand-new approach for the alloy/substrate material design enhancing interconnect durability.