The Effect of Microbead Fusion Flexible Friction-Assisted Electroforming on the Surface Roughness of Electroformed Layers

The surface quality of high-performance electroformed components, such as the matrix material of the rocket thrust chamber wall, is critical to the overall performance of the devices. However, under high current density and elevated cathode rotation speeds, excessive internal stress often leads to layer detachment, compromising coating adhesion and stability. This study introduces an improved electroforming process termed microbead fusion flexible friction-assisted electroforming (MF3AEF) and examines its effect on the surface roughness of electroformed copper layers. By comparing conventional direct current electroforming (DCEF), abrasive-assisted electroforming (AAEF) with free ceramic beads, and the proposed MF3AEF process, this work investigates the variations in surface quality and roughness under different current densities and cathode rotation speeds. The results indicate that at a current density of 6.8 A/dm2 and a cathode rotation speed of 90 rpm, the surface roughness of the MF3AEF-produced layer is reduced to Ra0.24 µm, representing a 98.2% reduction compared to the Ra13.35 µm achieved by DCEF. This demonstrates that MF3AEF significantly enhances surface properties and markedly reduces the surface roughness of electroformed layers.