Research on Electrolyte in Slurry for Photoelectrochemical Mechanical Polishing of GaN Wafers

Gallium nitride (GaN), owing to its excellent properties, has emerged as a promising material for wide range of applications. However, due to the high hardness and outstanding chemical stability of GaN, the efficiency of its chemical mechanical polishing (CMP) is relatively low. Photoelectrochemical mechanical polishing (PECMP) has emerged as a highly effective technique for GaN polishing. However, the development of appropriate slurry for PECMP remains a pressing issue, as achieving an optimal balance among electrical conductivity, transmittance, and particle stability is particularly challenging. This research delves into novel slurry designed for GaN PECMP. A systematic investigation is conducted to explore the impact of electrolyte type, concentration, temperature and pH on the performance of the slurry, and conducted PECMP test to evaluate performance of silica sol mixed electrolyte in PECMP. Results indicate that among the electrolytes tested, monovalent cations, particularly in the case of 0.2 M Li2SO4 provided a favorable balance, enhancing conductivity considerably while largely maintaining high UV transmittance and particle dispersion stability over the experimental period. In contrast, divalent cations induce severe aggregation, degrading polishing performance. pH experiment reveals the stability of silica sol arises from the synergistic interplay of surface electrical properties, electrolyte characteristics, and the intrinsic chemical stability of the material PECMP test confirms that aggregated particles from unstable slurries cause surface scratches and pits. Under optimized conditions (0.2 M Li2SO4, 20 nm silica at 5 wt%), the slurry achieved a surface finish with Sₐ 0.292 nm. These results provide profound insights for the design of advanced PECMP slurries and make a significant contribution to the continuous development of GaN wafer manufacturing technology.

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Publication Details

Journal
Surface Science and Technology
Published
2025-10-27
DOI
https://doi.org/10.1007/s44251-025-00095-4
Citations
1
Primary Topic
Advanced Surface Polishing Techniques
Type
article
Field-Weighted Citation Impact
0.67

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article

Research on Electrolyte in Slurry for Photoelectrochemical Mechanical Polishing of GaN Wafers

Jihao Zhang, Zhigang Dong, Shang Gao, Xianglong Zhu et al.
1 citations
Surface Science and Technology
Advanced Surface Polishing Techniques
0.67
article

Research on Electrolyte in Slurry for Photoelectrochemical Mechanical Polishing of GaN Wafers

Jihao Zhang, Zhigang Dong, Shang Gao, Xianglong Zhu, Jiajian Feng, Yuewen Sun
article en
1 citations

Abstract

Gallium nitride (GaN), owing to its excellent properties, has emerged as a promising material for wide range of applications. However, due to the high hardness and outstanding chemical stability of GaN, the efficiency of its chemical mechanical polishing (CMP) is relatively low. Photoelectrochemical mechanical polishing (PECMP) has emerged as a highly effective technique for GaN polishing. However, the development of appropriate slurry for PECMP remains a pressing issue, as achieving an optimal balance among electrical conductivity, transmittance, and particle stability is particularly challenging. This research delves into novel slurry designed for GaN PECMP. A systematic investigation is conducted to explore the impact of electrolyte type, concentration, temperature and pH on the performance of the slurry, and conducted PECMP test to evaluate performance of silica sol mixed electrolyte in PECMP. Results indicate that among the electrolytes tested, monovalent cations, particularly in the case of 0.2 M Li2SO4 provided a favorable balance, enhancing conductivity considerably while largely maintaining high UV transmittance and particle dispersion stability over the experimental period. In contrast, divalent cations induce severe aggregation, degrading polishing performance. pH experiment reveals the stability of silica sol arises from the synergistic interplay of surface electrical properties, electrolyte characteristics, and the intrinsic chemical stability of the material PECMP test confirms that aggregated particles from unstable slurries cause surface scratches and pits. Under optimized conditions (0.2 M Li2SO4, 20 nm silica at 5 wt%), the slurry achieved a surface finish with Sₐ 0.292 nm. These results provide profound insights for the design of advanced PECMP slurries and make a significant contribution to the continuous development of GaN wafer manufacturing technology.

Surface Science and TechnologyVol. 3(1)
Dalian University of Technology (CN)
National Natural Science Foundation of China
Openalex Percentile: Top 25%
Advanced Surface Polishing Techniques
0.67
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