Ru:Al <sub>2</sub> O <sub>3</sub> Resistive Coatings Fabricated by Atomic Layer Deposition for Application in Microchannel Plates

This study investigated the atomic layer deposition (ALD) of ruthenium (Ru)-doped aluminum oxide (Al2O3) thin films for potential application as resistive layers in high-aspect-ratio microchannel plate (MCP) electron amplifiers. A Ru precursor, tricarbonyl(trimethylenemethane)ruthenium, C4H6Ru(CO)3 ([Ru(TMM)(CO)3]) and O2 coreactant were employed for Ru ALD, while trimethyl aluminum (TMA) and H2O were used for the Al2O3 ALD. A combination of in situ experimental measurements and theoretical calculations was utilized to investigate the adsorption behavior of the [Ru(TMM)(CO)3] precursor on hydroxylated surfaces and the growth characteristics of Ru ALD thin films. A relatively constant growth per cycle value of ∼1.7 Å/cycle was observed at 240 °C. By varying the ratio of Ru ALD cycles to Al2O3 ALD cycles, Ru:Al2O3 composite thin films were deposited where the resistivity could be tuned in the range of 107–1013 Ω.cm, which is suitable for application in MCPs. The impact of annealing on the composition and resistivity of the Ru:Al2O3 thin films was also explored. The results demonstrate the potential of Ru:Al2O3 films as resistive layers for MCPs and other applications including advanced microelectronics.

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Publication Details

Journal
ACS Applied Engineering Materials
Published
2025-10-24
DOI
https://doi.org/10.1021/acsaenm.5c00676
Primary Topic
Semiconductor materials and devices
Type
article
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article

Ru:Al 2 O 3 Resistive Coatings Fabricated by Atomic Layer Deposition for Application in Microchannel Plates

Donghyeon Kang, Adnan Mohammad, Li Shi, Chi Thang Nguyen et al.
ACS Applied Engineering Materials
Semiconductor materials and devices
article

Ru:Al 2 O 3 Resistive Coatings Fabricated by Atomic Layer Deposition for Application in Microchannel Plates

Donghyeon Kang, Adnan Mohammad, Li Shi, Chi Thang Nguyen, Ashley R. Bielinski, Jeffrey W. Elam, Sungjoon Kim, Rajeev S. Assary, J.H. Kang, Yoav Malka
article en

Abstract

This study investigated the atomic layer deposition (ALD) of ruthenium (Ru)-doped aluminum oxide (Al2O3) thin films for potential application as resistive layers in high-aspect-ratio microchannel plate (MCP) electron amplifiers. A Ru precursor, tricarbonyl(trimethylenemethane)ruthenium, C4H6Ru(CO)3 ([Ru(TMM)(CO)3]) and O2 coreactant were employed for Ru ALD, while trimethyl aluminum (TMA) and H2O were used for the Al2O3 ALD. A combination of in situ experimental measurements and theoretical calculations was utilized to investigate the adsorption behavior of the [Ru(TMM)(CO)3] precursor on hydroxylated surfaces and the growth characteristics of Ru ALD thin films. A relatively constant growth per cycle value of ∼1.7 Å/cycle was observed at 240 °C. By varying the ratio of Ru ALD cycles to Al2O3 ALD cycles, Ru:Al2O3 composite thin films were deposited where the resistivity could be tuned in the range of 107–1013 Ω.cm, which is suitable for application in MCPs. The impact of annealing on the composition and resistivity of the Ru:Al2O3 thin films was also explored. The results demonstrate the potential of Ru:Al2O3 films as resistive layers for MCPs and other applications including advanced microelectronics.

ACS Applied Engineering MaterialsVol. 3(11)
Argonne National Laboratory (US), Division of Materials Science and Engineering (AU)
Openalex Percentile: Top 70%
Semiconductor materials and devices
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Ru:Al <sub>2</sub> O <sub>3</sub> Resistive Coatings Fabricated by Atomic Layer Deposition for Application in Microchannel Plates — Donghyeon Kang, Adnan Mohammad, et al. · ACS Applied Engineering Materials (2025) | TGRS Research Map | TGRS