Improving the Durability of Adhesive Films Using Fluorinated Polymers to Streamline Transfer Processes in Semiconductor Manufacturing

ABSTRACT With technological advancements accelerating the miniaturization and diversification of electronic devices, modern semiconductor‐manufacturing processes require greater precision and efficiency. Specifically, the transfer process—which involves relocating fine components or layers between substrates—is critical. Pressure‐sensitive adhesive (PSA) films are widely used to enable precise and repeatable transfers. However, existing reusable adhesives suffer performance degradation due to changes in surface properties and contamination during processing, which limits their reusability to approximately 80,000 transfer cycles. In this study, an acrylic copolymer‐based PSA film was developed by optimizing the monomer composition to achieve ideal adhesion characteristics. Moreover, a thermal treatment was performed to improve reusability, and fluorine was introduced into the copolymer to enhance durability. These strategies minimized surface property changes and contamination during repeated use. Furthermore, the introduction of isocyanate crosslinking significantly increased the number of reuse cycles by more than three times the current industry standard. The developed adhesives overcome the limitations of conventional PSA films and can significantly improve the productivity, reliability, and efficiency of the semiconductor transfer process. Thus, these high‐reliability adhesive films imply not only enhanced productivity but also promising applicability in next‐generation semiconductor manufacturing processes, and they could be further extended to practical industrial implementation through pilot‐scale validation.