Study on the Damage of 6H‐SiC During the Grinding Process by C‐Ion Implantation Based on Molecular Dynamics

Abstract To improve the machinability of the brittle material 6H‐SiC (6H‐Silicon Carbide), a novel surface modification approach based on ion implantation is proposed. Molecular dynamics simulations are conducted to investigate the mechanical properties and defect evolution of ion‐implanted single‐crystal 6H‐SiC under nanoindentation conditions. The influences of implantation dose, energy, and angle on indentation force, dislocation behavior, hardness, and elastic modulus are systematically analyzed. The findings contribute to advancing high‐precision manufacturing technologies for silicon carbide materials.

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Publication Details

Journal
Advanced Theory and Simulations
Published
2025-10-22
DOI
https://doi.org/10.1002/adts.202500765
Primary Topic
Metal and Thin Film Mechanics
Type
article
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article

Study on the Damage of 6H‐SiC During the Grinding Process by C‐Ion Implantation Based on Molecular Dynamics

Weiwen Hu, Xinyi Luo, Hui Yang, Nanxing Wu et al.
Advanced Theory and Simulations
Metal and Thin Film Mechanics
article

Study on the Damage of 6H‐SiC During the Grinding Process by C‐Ion Implantation Based on Molecular Dynamics

Weiwen Hu, Xinyi Luo, Hui Yang, Nanxing Wu, Hong Jiang, Qi Zheng
article en

Abstract

Abstract To improve the machinability of the brittle material 6H‐SiC (6H‐Silicon Carbide), a novel surface modification approach based on ion implantation is proposed. Molecular dynamics simulations are conducted to investigate the mechanical properties and defect evolution of ion‐implanted single‐crystal 6H‐SiC under nanoindentation conditions. The influences of implantation dose, energy, and angle on indentation force, dislocation behavior, hardness, and elastic modulus are systematically analyzed. The findings contribute to advancing high‐precision manufacturing technologies for silicon carbide materials.

Advanced Theory and SimulationsVol. 9(2)
Jingdezhen Ceramic Institute (CN)
Openalex Percentile: Top 65%
Metal and Thin Film Mechanics
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