A Method for Preparing Diamond Films with High Thermal Stability

Due to the outstanding thermal stability of diamond film, diamond films have extensive application prospects in fields such as electronics, optics, biomedicine, and aerospace, and are one of the important materials driving the development of modern science and technology. Moreover, the cost of single-crystal diamond substrates is high, and it is difficult to achieve large-scale batch production. A direct current arc plasma jet chemical vapor deposition method, combined with post-treatment steps such as nano-diamond seed crystal implantation, surface modification, and high-temperature annealing, is used to prepare high-quality diamond films. The relationship between the thermal conductivity and optical properties of diamond films is analyzed in detail. The experimental results showed that diamond film has a relatively smooth surface, with a surface roughness that can reach 3 nm. As the temperature rises, diamond films exhibit good crystal orientation and thermal stability, the FWHM of reflection peaks become smaller, and thermal conductivity can reach 1734 W/(m·K). The infrared testing analysis also confirmed that the diamond film has excellent thermal diffusion properties. When the diamond film is applied to power device chips, it can effectively reduce the junction temperature of 30 °C. The preparation method proposed in this paper is expected to break through the cost and scale limitations of high-performance diamond films, thereby promoting the wide application of diamond films in industries.