Review on the polishing of internal channels of the additively manufactured metallic components
Metal additive manufacturing (AM) achieves near-net-shape forming capability and thus offers distinct advantages over conventional machining in fabricating components with complex internal channel geometries. Nevertheless, the as-fabricated channels typically exhibit suboptimal surface quality characterized by elevated roughness, partially sintered powder adhesion, and spherical melt droplets, all of which detrimentally affect component performance and operational reliability. The precision finishing of these intricate internal surfaces remains a significant technological bottleneck that hindering the broader industrial implementation of metal AM. This review comprehensively examines four principal surface enhancement techniques for internal channels: abrasive flow polishing, chemical polishing, electrochemical polishing, and electrolyte plasma polishing. Through a systematic comparison of their process mechanisms, operational constraints, and recent technological advancements, we elucidate their respective merits and limitations as well as identify promising development directions. The analysis in this review is beneficial in providing crucial insights for surface quality optimization, addressing current AM challenges, and facilitating the technology's industrial maturation.
Authors
- Zhong Xin (ORCID: https://orcid.org/0000-0002-6542-2699)
- X. W. Wang
- Hu‐Jun Qian (ORCID: https://orcid.org/0000-0001-8149-8776)
- Jingjing Wang (ORCID: https://orcid.org/0009-0003-5543-878X)
- Jie Wan (ORCID: https://orcid.org/0000-0002-2308-787X)
Publication Details
- Journal
- Materials and Solidification
- Published
- 2025-10-21
- DOI
- https://doi.org/10.26599/mas.2025.9580015
- Primary Topic
- Additive Manufacturing Materials and Processes
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China
- State Key Laboratory of Solidification Processing
- Fundamental Research Funds for the Central Universities