Optimization of the Temperature Field and Design for Enhancing Uniform Temperature Distribution in Silicone Heating Plates

Introduction: In order to solve the problem of uneven temperature distribution in silicone heating plates, researchers have investigated their design and performance. Silicone heating plates, as efficient heating elements, have found widespread applications in multiple fields. However, existing silicone heating plates exhibit significant limitations in terms of temperature uniformity, which to some extent, affects their heating efficiency and stability. The silicone heater has a width of 595 mm, a length of 1220 mm, and each layer of the silicone plate has a thickness of 1.125 mm. Methods: Using the finite element analysis method, the heating wires within the silicone heating plate were rearranged. In our research, we first established a finite element model of the silicone heating plate and identified the influence of heating wire arrangement on temperature uniformity through simulation analysis. Based on the analysis results, we then optimized the arrangement of the heating wires to improve the uniformity of the temperature field. Results: Through multiple simulations and experimental validations, this paper has achieved temperature homogenization in silicone heating plates. The results indicate that after rearranging the heating wires within the silicone heating plate using the finite element analysis method, the temperature uniformity of the plate has been significantly enhanced. Discussion: This approach not only addresses the limitations of existing silicone heating plates in terms of temperature uniformity, but also boosts their overall performance and stability. The method proposed in this study, which utilizes finite element analysis to optimize the arrangement of heating wires in silicone heating plates, demonstrates high feasibility. Conclusion: This approach offers a novel perspective on addressing the issue of temperature uniformity in silicone heating plates and holds significant theoretical and practical importance.

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Publication Details

Journal
Recent Patents on Mechanical Engineering
Published
2025-10-08
DOI
https://doi.org/10.2174/0122127976391882250910200400
Primary Topic
Engineering Applied Research
Type
article
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article

Optimization of the Temperature Field and Design for Enhancing Uniform Temperature Distribution in Silicone Heating Plates

Wanli Lu, Shiqian Ni, Junshan Wang
Recent Patents on Mechanical Engineering
Engineering Applied Research
article

Optimization of the Temperature Field and Design for Enhancing Uniform Temperature Distribution in Silicone Heating Plates

Wanli Lu, Shiqian Ni, Junshan Wang
article en

Abstract

Introduction: In order to solve the problem of uneven temperature distribution in silicone heating plates, researchers have investigated their design and performance. Silicone heating plates, as efficient heating elements, have found widespread applications in multiple fields. However, existing silicone heating plates exhibit significant limitations in terms of temperature uniformity, which to some extent, affects their heating efficiency and stability. The silicone heater has a width of 595 mm, a length of 1220 mm, and each layer of the silicone plate has a thickness of 1.125 mm. Methods: Using the finite element analysis method, the heating wires within the silicone heating plate were rearranged. In our research, we first established a finite element model of the silicone heating plate and identified the influence of heating wire arrangement on temperature uniformity through simulation analysis. Based on the analysis results, we then optimized the arrangement of the heating wires to improve the uniformity of the temperature field. Results: Through multiple simulations and experimental validations, this paper has achieved temperature homogenization in silicone heating plates. The results indicate that after rearranging the heating wires within the silicone heating plate using the finite element analysis method, the temperature uniformity of the plate has been significantly enhanced. Discussion: This approach not only addresses the limitations of existing silicone heating plates in terms of temperature uniformity, but also boosts their overall performance and stability. The method proposed in this study, which utilizes finite element analysis to optimize the arrangement of heating wires in silicone heating plates, demonstrates high feasibility. Conclusion: This approach offers a novel perspective on addressing the issue of temperature uniformity in silicone heating plates and holds significant theoretical and practical importance.

Recent Patents on Mechanical EngineeringVol. 19
Nanjing Institute of Technology (CN), Nanjing Institute of Railway Technology (CN)
Openalex Percentile: Top 69%
Engineering Applied Research
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