Optimization of the Electrochemical Deposition Method for Preparation Magnetic/Non-Magnetic Multilayered Structures

The new approach for electrochemical deposition of the magnetic/non-magnetic metal multilayered film structures was proposed.The joint complex electrolyte based on Ni 2+ ; Fe 2+ and Cu 2+ salts was developed.This complex electrolyte that contains compounds for magnetic (NiFe alloy) and non-magnetic (Cu) layers can be successfully used for permalloy/copper multilayered structures preparation.NiFe alloy and Cu electrodeposition kinetics was studied and optimal potential and current ranges for NiFe and Cu were estimated.The possibility of synthesizing single-layer ferromagnetic NiFe films, single-layer diamagnetic Cu films, as well as multilayer NiFe/Cu/NiFe films from a single complex electrolyte has been demonstrated.In the potential range from -0.25 to -0.4 V, a copper films without nickel and iron impurities were deposited.The Ni/Fe ratio in the alloy increases from 2.51 to 4.76 as the potential decreases from -0.92 to -0.95 V.The extra low Cu impurity in NiFe films was achieved (down to 3.2 at.%).It opens broad perspectives for application this approach for preparation of the layered film structures from one joint technological cycle.The critically low concentration of the non-magnetic impurities in magnetic layers as well as sharp interface boundaries between layers are key parameters for practical application.