Thin-film Cu <sub> 1− <i>x</i> </sub> N <sub> <i>x</i> </sub> catalysts for efficient CO <sub>2</sub> reduction: a scalable magnetron sputtering approach
Reactive sputtering of N 2 , through physical vapor deposition, fabricated N-containing Cu thin films that serve as an efficient alternative compared to metallic Cu for the electrochemical CO 2 reduction.
Authors
- Pegie Cool (ORCID: https://orcid.org/0000-0002-6632-2243)
- Mathias van der Veer (ORCID: https://orcid.org/0009-0000-4909-8852)
- Tom Breugelmans (ORCID: https://orcid.org/0000-0001-5538-0408)
- Nick Daems (ORCID: https://orcid.org/0000-0001-7230-8950)
Institutions
- University of Antwerp (BE)
Publication Details
- Journal
- EES Catalysis
- Published
- 2025-10-15
- DOI
- https://doi.org/10.1039/d5ey00246j
- Primary Topic
- Catalytic Processes in Materials Science
- Type
- article
- Field-Weighted Citation Impact
- 0.00