Electromagnetic Transient Simulation Analysis and Verification of Insulation Degradation Process in Common-Envelope Busbar Based on Multi-Physics Coupling

Based on electromagnetic transient simulations of common-envelope busbar faults, this paper systematically deconstructs the fault mechanisms and development processes. A case study of a common-envelope busbar failure in a thermal power plant is thoroughly analyzed, where seal failure of the enclosure led to dielectric moisture and subsequent discharge to the cover plates. Accordingly, systematic improvement strategies are proposed, including seal structure reinforcement, real-time insulation condition monitoring, and condensation/water accumulation prevention. This provides technical references for addressing potential risks in similar equipment.