Microstructure and Mechanical Properties of CuZr Thin-Film Metallic Glasses Deposited by Magnetron Sputtering

As a novel class of thin films, thin-film metallic glasses (TFMGs) hold broad application prospects in biomedicine, electronic components, etc. In this study, CuZr TFMGs were deposited at room temperature using a medium-frequency magnetron sputtering (MFMS) technique. The effects of bias voltage on the microstructure and properties of the films were systematically investigated. The results indicate that the CuZr system exhibits excellent glass-forming ability (GFA), with films possessing a smooth surface. As bias voltage increases, cross-sectional morphology transitions from a glassy morphology to a dimple-like structure. The high bias voltage induces reduced dimple size and significantly increased density. At a bias voltage of −50 V, the hardness of CuZr film reaches a maximum of 9.6 GPa. This hardness is approximately five times and twice that of pure Cu and Zr films, respectively. Compared with Zr film, CuZr TFMGs exhibit a significantly reduced friction coefficient while maintaining a low wear rate. All CuZr films demonstrate excellent electrical conductivity and hydrophobicity, providing the basis for future potential applications.