Thin Film Fragmentation Testing: A Refined Screening Method for Estimating Relative Intrinsic Ductility of Refractory Metals

Refractory metals typically exhibit limited room temperature ductility, hampering their widespread application. Recent advances in refractory high-entropy alloys have focused on finding optimum combinations of strength and ductility but require exploring vast compositional spaces. To facilitate such a search process, a method for fast assessment of intrinsic ductility would be highly advantageous. Herein, we propose a novel approach to screen for a refractory alloy’s ‘intrinsic ductility’ by leveraging the established technique of thin film fragmentation testing, which has been successfully used to evaluate stretchability of flexible electronics. We conducted in-depth investigations of sputtered tungsten thin films to identify the processing-induced extrinsic variables that can affect the crack onset strain (COS) under uniaxial loading. By tuning the process parameters for film deposition, Nb, Mo, Ta and W samples were fabricated with comparable thicknesses and residual stress levels. The films’ COS values were compared to the ductility levels of bulk counterpart materials, and the conditions for meaningful comparison are discussed. This approach offers a simple, inexpensive, and rapid means of screening based on relative intrinsic ductility of thin metal films and should also be applicable to the study of high-entropy alloy films.