Development and Experimental Validation of a Filament-Assisted Chemical Vapor Deposition (FACVD) Reactor Using a Plastic Chamber

This study explored the feasibility of using a plastic vacuum chamber for the Filament-Assisted Chemical Vapor Deposition (FACVD) of polymer thin films. Traditional chemical vapor deposition (CVD) methods often require high vacuum and elevated temperatures, which limit their use for heat-sensitive and flexible substrates. FACVD enables polymer deposition under mild vacuum and temperature conditions, providing an opportunity to utilize plastic vacuum chambers as cost-effective and easily machinable alternatives to metallic chambers. In this study, a custom-designed acrylic chamber was fabricated and integrated into an FACVD system. Glycidyl methacrylate (GMA) and tert-butyl peroxide (TBPO) were considered as the monomer and initiator, respectively, for creating thin films under a low-temperature and moderate-vacuum deposition process. Polymeric film (pGMA) contains reactive epoxy groups that allow versatile post-polymerization modifications and are widely applied in coatings and biomedical fields. Preliminary experiments demonstrated the successful growth of pGMA thin films, with Fourier-transform infrared spectroscopy (FT-IR) and X-ray photoelectron spectroscopy (XPS) confirming the characteristic polymer features, including the disappearance of the C=C stretching band as direct evidence of polymerization. Ellipsometry determines a uniformity of film thickness of approximately 85% for the 4-inch wafers’ area, with deposition rates in the range of 18–26 nm/h. These results highlight the potential of polymer-based chambers as cost-effective and versatile alternatives to advanced vapor-phase polymerization processes.

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Publication Details

Journal
Coatings
Published
2025-10-15
DOI
https://doi.org/10.3390/coatings15101213
Primary Topic
Semiconductor materials and devices
Type
article
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article

Development and Experimental Validation of a Filament-Assisted Chemical Vapor Deposition (FACVD) Reactor Using a Plastic Chamber

Jeong Heon Lee, Jae B. Kwak, H. C. Kang
Coatings
Semiconductor materials and devices
article

Development and Experimental Validation of a Filament-Assisted Chemical Vapor Deposition (FACVD) Reactor Using a Plastic Chamber

Jeong Heon Lee, Jae B. Kwak, H. C. Kang
article en

Abstract

This study explored the feasibility of using a plastic vacuum chamber for the Filament-Assisted Chemical Vapor Deposition (FACVD) of polymer thin films. Traditional chemical vapor deposition (CVD) methods often require high vacuum and elevated temperatures, which limit their use for heat-sensitive and flexible substrates. FACVD enables polymer deposition under mild vacuum and temperature conditions, providing an opportunity to utilize plastic vacuum chambers as cost-effective and easily machinable alternatives to metallic chambers. In this study, a custom-designed acrylic chamber was fabricated and integrated into an FACVD system. Glycidyl methacrylate (GMA) and tert-butyl peroxide (TBPO) were considered as the monomer and initiator, respectively, for creating thin films under a low-temperature and moderate-vacuum deposition process. Polymeric film (pGMA) contains reactive epoxy groups that allow versatile post-polymerization modifications and are widely applied in coatings and biomedical fields. Preliminary experiments demonstrated the successful growth of pGMA thin films, with Fourier-transform infrared spectroscopy (FT-IR) and X-ray photoelectron spectroscopy (XPS) confirming the characteristic polymer features, including the disappearance of the C=C stretching band as direct evidence of polymerization. Ellipsometry determines a uniformity of film thickness of approximately 85% for the 4-inch wafers’ area, with deposition rates in the range of 18–26 nm/h. These results highlight the potential of polymer-based chambers as cost-effective and versatile alternatives to advanced vapor-phase polymerization processes.

CoatingsVol. 15(10)
Chosun University (KR)
Openalex Percentile: Top 71%
Semiconductor materials and devices
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